Промышленная материнская плата Advantech AIMB-279

Mini-ITX материнская плата на процессорах Intel® Core™ 12/13-го поколения (Raptor Lake/Alder Lake), с Q670E/H610E, PCIex16 Gen4, 2.5GbE, DCin Advantech AIMB-279

Цены и наличие

Код товара	Описание товара	Цена с НДС	Наличие на складе
AIMB-279QF-LDA1	Промислова материнська плата AIMB-279 mITX на процесорах Intel® Core™ 12/13-го покоління (Raptor Lake/Alder Lake), з Q670E, PCIex16 Gen4, 2.5GbE, DCin	24 070,9
AIMB-279HL-EDA1	Промислова материнська плата AIMB-279 mITX на процесорах Intel® Core™ 12/13-го покоління (Raptor Lake/Alder Lake), з H610E, PCIex16 Gen4, 2.5GbE, DCin	19 929,4

• Процессоры Intel® Core™ 12-го/13-го поколения, макс. 24 ядра, поддержка чипсетов Q670E/H610E
• До 64 ГБ DDR4 3200 МГц с двумя модулями SODIMM
• PCIe x16 Gen4 (16 ГТ/с)
• Четыре независимых дисплея 2 DP, 1 HDMI, 1 eDP
• Богатые возможности расширения: 1 M.2 M ключ и 1 M.2 E ключ, 4 USB 3.2 и 2 USB2.0, 2 SATA
• Вход питания 12-24 В DCIN
• WISE-DeviceOn и API для встраиваемого ПО

13th Generation Processors
CPU	i9-13900E / i9-13900	i9-13900TE	i7-13700E / i7-13700	i7-13700TE	i5-13500E / i5-13500	i5-13500TE	i5-13400E/ i5-13400	i3-13100E / i3-13100	i3-13100TE
Core Number	24	24	16	16	14	14	10	4	4
Base frequency (GHz)	1.8/2.0	1	1.9/2.1	0.8	2.4/2.6	1.3	2.4/2.5	3.3/3.4	2.4
Max Speed (GHz)	5.2/5.6	5	5.1/5.2	4.8	4.6/4.8	4.5	4.6	4.4/4.5	4.1
Smart cache (MB)	36	36	30	30	24	24	20	12	12
TDP (W)	65	35	65	35	65	35	65	60	35
12th Generation Processors
CPU	i9-12900E / i9-12900	i9-12900TE	i7-12700E / i7-12700	i7-12700TE	i5-12500E / i5- 12500/12400	i5-12500TE	i3-12100E / i3-12100	i3-12100TE	G7400E	G7400TE	G6900E	G6900TE
Core Number	16	16	12	12	6	6	4	4	2	2	2	2
Base frequency (GHz)	2.3/2.4	1.1	2.1	1.4	2.9/3.0/2.5	1.9	3.2	2.1	3.6	3	3	2.4
Max Speed (GHz)	5	4.8	4.8	4.7	4.5/4.6/4.4	4.3	4.2/4.3	4	NA	NA	NA	NA
Smart cache (MB)	30	30	25	25	18	18	12	12	6	6	4	4
TDP (W)	65	35	65	35	65	35	60	35	46	35	46	35

Дополнительная информация

Processor System
Chipset	Q670E / H610E
BIOS	AMI EFI 256Mb SPI
Expansion Slot
M.2	1 M-Key for SSD, 1 E-Key for Wireless connection
PCIe x16	PCIe x16 Gen4 (16GT/s) for discrete GPU card and storage devices
Memory
Technology	Dual Channel DDR4, up to 3200 MHz (non-ECC)
Max. Capacity	64GB (up to 32GB per SODIMM)
Socket	2 x 260pin SODIMM
Graphics
Controller	Intel® UHD Graphics Driven by Xe Architecture
HDMI	HDMI2.0b, supports max. resolution 4096 x 2160 @ 60 Hz
DP	2 DP++, DP1.4a, supports max. resolution 4096 x 2304 @ 60 Hz
eDP	By option, with internal pin header, supports max. resolution 4096 x 2304 @ 60 Hz
LVDS	By default, internal pin header, supports singel/dual channel 18/24-bit with maximum resolution up to 1920 x 1200 @ 60 Hz (eDP colay with LVDs)
Multi Displays	up to 4 independent displays (4 with Q670E)
Network
ETHERNET	up to 2500 Mb/s
Controller	LAN1: Intel i219 (GbE) LAN2: Intel i226 (2.5GbE)
Connector	2 x RJ45
SATA
Max data transfer rate	600 MB/s
Channel	2 x SATAIII
Rear I/O
DP	2
HDMI	1
Ethernet	2
USB	2 ports USB3.2 Gen2x1
Audio	1 (Line in/Line out/Mic in)
Internal Connector
USB	2 ports USB3.2 Gen1x1 & 2 ports USB2.0
LVDS/eDP	1 (LVDs colay with eDP)
Serial	2 ports (COM1 RS232, COM2 RS232/422/485)
SATA	2
M.2	1 M-key (dimension: 2242) 1 E-key (dimension: 2230)
GPIO	8-bit
Watchdog Timer
Output	System reset
Interva	Programmable 1 ~ 255 sec/min
Power Requirements	i9-13900E 5.2GHz, 2pcs 32GB DDR4 3200MHz, 24V @4.45A with 24V DC Input adapter
Environment
Temperature	Operating: 0 ~ 60° C (32 ~ 140° F), depends on CPU speed and cooler solution
Storage	Non-Operating: -40 ~ 85° C (-40 ~ 185° F)
Physical Characteristics
Dimensions	170 mm x 170 mm (6.69" x 6.69")