Expandable GPU-accelerated System powered by Intel® Core™ i9/i7/i5/i3 Processor 14th gen Vecow RCX-3750 PEG
The Vecow RCX-3000 PEG is an Expandable GPU-accelerated System powered by Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) Processor. The RCX-3000 PEG provides scalability with support for up to 7 PCIe expansions, making it capable of supporting a max 1800W power budget for dual 900W NVIDIA or AMD 2-slot full-length graphics card for AI and inferencing. Additionally, the RCX-3000 PEG offers rich I/O, including 2 GigE LAN with TSN, 4 USB 3.2 Gen 2, 4 COM, 32 Isolated DIO, 3 SIM card sockets, 1 Mini PCIe socket and provides 4 SATA for 2.5” SSD/HDD Tray. It also provides 2 front-access M.2 Key M SSD Trays for data storage. For industrial deployments, it features operating temperature range from -25°C to 45°C, and flexible power input options ranging from DC 16V to 50 and AC 90V to 220V.
The RCX-3000 PEG delivers workstation-grade computing capability, making it ideal for High-Speed AOI, 3D Mapping, Rolling Stock, and any Edge AI applications.
- Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) running with Intel® R680E PCH supports max 65W TDP CPU
- Max 1800W power budget supports dual 900W NVIDIA® or AMD 2-slot full-length graphics card
- Flexible Power Input Design with Software Ignition Control : DC 16V to 50V
- Up to 7 Slot PCIe expansions with PCIe 4.0 x8 and PCIe x4 signals
- 2 Front-access M.2 and 2 2.5" SSD Tray, multiple 5G/WiFi/4G/LTE/GPRS/UMTS
- 4 DisplayPort up to 4K resolution, USB 3.2 Gen 2x2 Type C with a max speed of 20Gbps data transfer supported, 2 Independent 2.5G LAN with Intel® TSN
- Support remote devices Out-Of-Band management functions powered by Allxon
Additional information
System |
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Processor |
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Chipset | Intel® R680E |
BIOS | AMI |
SIO | IT8786E |
Memory | 4 DDR5 UDIMM, up to 192GB (ECC/Non-ECC) |
OS | Windows 10/11, Linux |
I/O Interface |
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Serial | 4 COM RS-232/422/485 (ESD 8kV) |
USB |
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Isolated DIO | 32 Isolated DIO : 16 DI, 16 DO |
LED | HDD, Power, OOB |
SIM Card | 3 External SIM Card Sockets |
Expansion |
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Mini PCIe | 1 Mini PCIe Socket for PCIe/USB/SIM Card |
PCIe |
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M.2 |
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Graphics |
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Graphics Processor | Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture |
Interface | 4 Independent displays : 4 DisplayPort, up to 4096 x 2304 @60Hz |
Storage |
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SATA | 4 SATA III (6Gbps) support S/W RAID 0, 1, 5, 10 |
M.2 | 2 Front-access M.2 Key M SSD Tray (2280, PCIe x4) |
Storage Device |
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Audio |
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Audio Codec | Realtek® ALC888S-VD, 7.1 Channel HD Audio |
Audio Interface | 1 Mic-in, 1 Line-out |
Ethernet |
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LAN 1 | Intel® I226 2.5GigE LAN supports TSN |
LAN 2 | Intel® I226 2.5GigE LAN supports TSN |
Power |
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Power Input | DC 16V to 50V |
Power Interface | 4-pin Terminal Block : V+, V+, V-, V- |
Ignition Control | 16-mode Software Ignition Control |
Remote Switch | 3-pin Terminal Block |
Out-of-Band Management |
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MCU | Nuvoton NUC980 |
Interface | OOB LAN, 10/100Mb Ethernet LAN, RJ45 Connector |
Remote Management | Support Remote Power ON/OFF, Reset and Power Cycling |
Others |
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TPM | Infineon SLB9670 supports TPM 2.0, SPI Interface |
Watchdog Timer | Reset : 1 to 255 sec./min. per step |
Smart Mgmt. | Wake on LAN, PXE supported |
HW Monitor | Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
Mechanical |
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Dimension | 254mm x 269mm x 398mm (10.00"x 10.59"x 15.67") |
Weight | 10.2 kg (22.5lb) |
Mounting |
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Environment |
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Operating Temp. | -25°C to 45°C (-13°F to 113°F), with air flow |
Storage Temp. | -25°C to 85°C (-13°F to 185°F) |
Humidity | 5% to 95% Humidity, non-condensing |
Relative humidity | 95% @45°C |
Shock/Vibration |
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EMC | CE, FCC, EN50155, EN50121-3-2 |