2xCOM 2xLAN 4xLAN Din-Rail Mount Extended T range Input 12V DC Input 24V DC Input Wide range LAN MIL-STD-810 PCIex Bus POE ports RS232 RS485 Wallmount

EN50155 NVIDIA® Jetson AGX Orin™ Embedded AI Computing System Vecow EAC-5000

Vecow EAC-5000 Series is powered by NVIDIA Jetson AGX Orin platform that features an Arm® Cortex®-A78AE CPU delivering up to 275 TOPS of AI performance and integrates an advanced NVIDIA Ampere architecture GPU with 64 Tensor Cores. It’s capable of delivering server-class performance for edge AI applications.

The EAC-5000 Series is rugged in design and supports high compute density with I/O flexibility, including 8 GMSL2 cameras, 1 PCIe x8 slot, 2 GigE LAN with an optional choice of X-coded M12 connector, 5 USB, 2 COM, 2 Isolated CAN Bus, and 2 SIM card sockets. With support for 9V to 50V wide range DC-in, operating temperature range from -25°C to 70°C, as well as software ignition control, Vecow EAC-5000 Series is ideal for in-vehicle computing, robotic control, machine vision, intelligent video analytics, mobile robots, and any embedded AI applications.

Furthermore, the EAC-5000 Series supports the NVIDIA JetPack™ 6 software development kit, which expands the Jetson platform’s flexibility and scalability to accelerate AI application deployment.

  • Advanced NVIDIA® Jetson AGX Orin™ platform delivers up to 275 TOPS AI performance
  • The latest NVIDIA Ampere™ architecture, featuring with 2048 NVIDIA® CUDA® cores and 64 Tensor cores
  • Supports 8 GMSL 1/2 automotive cameras with Fakra-Z connectors
  • 1 PCIe Gen3 x8 expansion slot supports optional multiple 10GigE/PoE LAN/USB connections
  • 6 GigE LAN with 4 PoE+, 1 Digital Display supports 4K60
  • 2 Isolated CAN Bus support Flexible Data-rate, 2 COM RS-232/422/485, 5 USB 3.1
  • Supports device remote management by Allxon
  • DC 9V to 50V wide range power input, Ignition Power Control

Additional information

System

CPU

R32 : 8-core Arm® Cortex® -A78AE v8.2 64-bit CPU

R64 : 12-core Arm® Cortex® -A78AE v8.2 64-bit CPU

GPU

R32 : 1792-core NVIDIA Ampere™ architecture GPU with 56 Tensor Cores

R64 : 2048-core NVIDIA Ampere™ architecture GPU with 64 Tensor Cores

DL Accelerator 2x NVDLA Engines
Memory

R32 : 1 32GB LPDDR5 DRAM

R64 : 1 64GB LPDDR5 DRAM

Software Support
  • Linux
  • NVIDIA JetPack SDK

I/O Interface

USB
  • 1 USB 3.2 Gen 2, supports up to10Gbps
  • 4 USB 3.1, support up to 5Gbps
Serial 2 COM RS-232/422/485
CAN Bus 2 Isolated CAN Bus support CAN FD
DIO 16 Isolated DIO (8 DI, 8 DO)
Micro USB 1 Micro USB console debug port, 1 Micro USB OS flash port
Button 1 Power Button, 1 Force Recovery Button, 1 Reset Button
LED Power, SSD, 2 User Programmable
SIM 2 SIM Card Socket
Antenna 6 Antenna for WiFi/4G/5G/LTE/GPRS/UMTS

Expansion

PCIe 1 PCIe x16 slot with PCIe 3.0 x8 signal
M.2
  • 1 M.2 Key B Socket (3042/3052, USB3)
  • 1 M.2 Key E Socket (2230, PCIe/USB)

Graphics

Interface 1 Digital Display, up to 4K60
Video Encode

R32 : 1x 4K @60, 3x 4K @30, 6x 1080p @60 (HEVC)

R64 : 2x 4K @60, 4x 4K @30, 8x 1080p @60 (HEVC)

Video Decode

R32 : 1x 8K @30, 4x 4K @30, 9x 1080p @60 (HEVC)

R64 : 1x 8K @30, 7x 4K @30, 11x 1080p @60 (HEVC)

Camera (EAC-5000)

GMSL 8 Fakra-Z connectors for GMSL 1/2 automotive cameras

Storage

M.2 2 M.2 Key M Socket (2280, PCIe Gen3 x4)
eMMC 1 eMMC 5.1, 64GB
SD 1 Micro SD (External)

Ethernet

LAN 1 to LAN 2 10/100/1000 Base-T Ethernet GigE LAN, RJ45 Connector (Optional X-coded M12 Connector)

PoE (EAC-5100)

LAN 3 to LAN 6

IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, RJ45 Connector (Optional X-coded M12 Connector)

Total PoE power budget support up to 60W at 25°C, 30W at 70°C

Power

Power Input DC 9V to 50V
Power Interface 3-pin Terminal Block : V+, V-, Frame Ground
Ignition Control 16-mode Software Ignition Control (non-OOB SKU only)
Remote Switch 3-pin Remote Switch Terminal Block

Out-of-Band Management

MCU Nuvoton NUC980
Interface OOB LAN, 10/100Mb Ethernet LAN, RJ45 Connector
Remote Management Support Remote Power ON/OFF, Reset and Power Cycling

Mechanical

Dimensions 260 mm x 182 mm x 69 mm (10.24’’ x 7.17’’ x 2.72’’)
Weight 3.8 kg (8.39 lb)
Mounting
  • Wallmount
  • DIN Rail and VESA Mount (Optional)

Environment

Operating Temp.

30W TDP Mode : -25°C to 70°C (-13°F to 158°F), with 0.63 m/s air flow

40/50W TDP Mode : -25°C to 55°C (-13°F to 131°F), with 0.63 m/s air flow

Storage Temp -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% @70°C
Shock Operating, MIL-STD-810G, Method 516.7, Procedure I
Vibration Operating, MIL-STD-810G, Method 514.6, Procedure I, Category 4
EMC CE, FCC, EN50155, EN50121-3-2

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