Industrial news

Advantech is excited to announce the latest enhancement to its MIC-7 product line: the MIC-770 V3 Extreme SKU, a fanless edge computer designed to excel in harsh environments.

Powered by the latest 12/13/14th Gen Intel® Core™ i socket-type (LGA1700) processors with the Intel® R680E/H610E chipset, this compact system delivers high-performance computing with multiple I/O interfaces and flexible expandability through i-Modules and iDoor technology. With an optimized fanless design and advanced thermal solution, the MIC-770 V3 Extreme SKU offers reliable operation without airflow, ensuring effective heat dissipation. This makes it highly durable in demanding industrial settings and remote locations.

Optimized Form Factor with High Performance for Harsh Environments without Airflow

The MIC-770 V3 Extreme SKU is a highly compact, modular IPC designed to provide superior performance in environments where traditional airflow-based cooling systems are not feasible. In challenging spaces—such as high-precision inspection equipment or welding areas with iron filings—reliable, ruggedized solutions are essential. Featuring the latest 12/13/14th Gen. Intel® Core™ processors, MIC-770 V3 Extreme SKU delivers exceptional computing power to handle demanding multitasking workloads, such as factory automation, machinery control, and process automation. With Advantech’s advanced thermal solution, it is capable of operating at up to 35°C with a 65W CPU, and up to 50°C with a 35W CPU. This innovative design ensures stable performance in and extreme environments that lack airflow, maintaining optimal CPU functionality—crucial for machine vision and automation inspection tasks. The MIC-770 V3 Extreme SKU guarantees reliable, durable performance while maximizing power and efficiency, making it an ideal choice for demanding industrial applications.

Modular Design Provides Flexibility for I/O Expansion and Easy Configuration

To meet the diverse needs of machine automation applications, the MIC-770 V3 series offers flexible expansion through Advantech’s Flex I/O, iDoor, and i-Module options. For example, Advantech offers a range of i-Module options to deliver powerful expansion capabilities, including 1-slot, 2-slot, 3-slot, 4-slot, additional storage, and GPU expansion modules. This flexibility allows customers to fulfill their specific needs, whether it's adding extra cards, increasing storage capacity, or enhancing computing power. When combining MIC-770 V3 Extreme SKU with i-Modules, its ruggedness and reliability with expanded functionality provides an ideal solution for high-speed data processing, Edge AI inference, deep learning, and other critical applications.

Application-Oriented Solution to Meet Various Industrial Requirements

The MIC-770 V3 Extreme SKU is designed as a robust, application-oriented solution that addresses a wide range of industrial needs. Its ruggedized chassis design and cast aluminum heatsink provides protection against vibration and shock, and the passive thermal solution ensures silent operation and reduced maintenance by eliminating airflow. Dust and dirt resistance further enhance its durability in harsh environments. The system also supports Windows 11, including Windows 11 IoT Enterprise LTSC with 10-year support and enhanced security, offering easy management and system protection. These features make the MIC-770 V3 Extreme SKU a powerful, reliable platform with rich I/O options and multiple display options suited for a variety of industrial environments.

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