Compact and Modular Rugged Embedded PC on 6th Generation Intel® Core™ Processor (Skylake-U) Cincoze DI-1000
Price and avalability
| Partnumber | Description | Price VAT incl | Avalability |
|---|---|---|---|
| DI-1000-i7-R11 | Компактний комп'ютер Cincoze DI-1000-i7-R11, 6th Gen. Intel® Core™ i7-6600U High Performance, Compact and Modular Rugged Embedded Computer | 79 507,2 | |
| DI-1000-i5-R11 | Компактний комп'ютер Cincoze DI-1000-i5-R11, 6th Gen. Intel® Core™ i5-6300U High Performance, Compact and Modular Rugged Embedded Computer | 67 148,2 | |
| DI-1000-i3-R11 | Компактний комп'ютер Cincoze DI-1000-i3-R11, 6th Gen. Intel® Core™ i3-6100U High Performance, Compact and Modular Rugged Embedded Computer | 55 969,9 |
Cincoze DI-1000 Series is a high-performance, compact and modular fanless embedded computer powered by 6th generation Intel® Core™ mobile processor (Skylake-U), it integrates Intel® HD graphic engine and accommodates one DDR4 socket up to 32 GB which allows DI-1000 Series to fulfill all kinds of high-end computing demands. Extremely compact size with dimension 203 x 142 x 66.8 mm, comprising unbeatable I/O such as DVI-I, DP, 2x LAN, 6x COM, 6x USB, 8x Optical Isolated DIO, PS/2, Mic-in, Line-out, and remote power on/off switch, supporting two full-size Mini-PCIe slots for wireless communication and I/O expansion, accommodating two 2.5” SATA HDD/SSD bay for RAID 0/1 function, making DI-1000 series unmatchable in the market for its size and functions. DI-1000 Series weighs only 1.65 kg supporting 4 types of mounting mechanisms (Wall, DIN, Side and VESA) allowing it to be installed everywhere. The unique Cincoze’s CMI (Combined Multiple I/O), CFM (Control Function Module) and MEC (Mini-PCIe Card) technologies allow DI-1000 Series to be expanded according to the specific needs. The options of ready-to-use modules including Multi-LAN, PoE, M12 connections, Power Ignition Sensing and various types of I/O interface, making DI-1000 series application-ready platform for factory automation, machine vision, in-vehicle, and mobile surveillance applications. DI-1000 Series inherited the Rugged DNA design from Cincoze, featuring Fan-less design, cable-less design, wide operating temperature (-40~ 70˚C), wide range DC input (9~48 VDC), high tolerance for shock and vibration, high standard electric protection, Long MTBF hours and integrated SuperCAP for CMOS battery maintenance-free. Those Rugged features making DI-1000 series suitable to be deployed in harsh and demanding environment.
- Onboard 6th Generation Intel® Core™ Mobile Processor (BGA Type)
- 1x DDR4 SO-DIMM Socket, 2133MHz, Supports Up to 32 GB
- Triple Independent Display (DVI-I, DisplayPort)
- Compact Size 203 x 142 x 66.8 mm with Light Weight 1.65 kg
- 1x Hot-swappable 2.5” SATA HDD/SSD Bay and 1x Internal 2.5” SATA HDD/SSD Bay, Supports RAID 0/1
- Rich I/O Including DVI, DP, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO
- Supports Cincoze CMI Technology for LAN, PoE & M12 Connector Expansion
- Supports Cincoze CFM Technology for Power Ignition Sensing (IGN) Function Expansion
- Cincoze MEC Module Kits for Various I/O Expansion
- 2x Full-size Mini-PCIe Slots for Wireless and I/O Expansion
- Wide Operating Temperature (-40°C to 70°C)
- E-Mark (E13, No.10R-0514273) Certified
Additional information
System |
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| Chipset | SoC |
| BIOS | AMI 8Mbit SPI BIOS |
| Memory | 1x DDR4 260-pin SO-DIMM Socket, Support up to 32 GB (2133MHz, Un-bu ered and Non-ECC type) |
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| Operating System | Windows® 10 / 8.1 / 7 |
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